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Joined: Feb 2000
Posts: 6,792 Likes: 44
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Joined: Feb 2000
Posts: 6,792 Likes: 44 |
The only problem with using heat is that the moisture expands as steam. Any heat applied at less than the boiling point will not remove moisture that has worked under the plating. The moisture trapped under the plating will then lift more plating as it expands. Silicon will penetrate and displace the moisture over a couple of days without damaging the existing surface.
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